Reading time: approximately 1 minute
Join us at booth E2.23 during the Warsaw Pack trade fair, taking place from April 8th to April 10th, 2025, in Nadarzyn near Warsaw. This is your chance to explore our advanced shrink sleeve application machines and discover our extensive range of shrink sleeve and pressure-sensitive labels.
Warsaw Pack is more than just a trade fair—it’s an opportunity to connect, exchange ideas, and stay ahead of industry trends. Visit our booth to discuss the latest developments in labeling and packaging technology and see how our expertise can benefit your business.
Don’t miss the chance to meet us and explore the future of packaging. See you at Warsaw Pack!
